Hello, Welcome to 4PCBA | Add to favorites
Service Time:9:00-18:00 | Login |Register |

PCB & Assembly The Easy Way
4PCBA.COM Full Services PCB Manufacturing

FULL SERVICE PCB MANUFACTURING

RayMing Technology has led the PCB industry for over 25 years, providing some of the most innovative printed circuit board technologies 
and highest quality standards found in the industry today. You can count on us to cater to your specific needs, from the simplest 
boards to the most complex designs for small quantity and large scale production.

Please see our ordering options below...

Items

Capabilities(Delivery area <5m2)

Capabilities(Delivery area ≥5m2)

Material

Normal FR4

Shengyi S1141(Not recommend it to lead free assembly process)

Shengyi S1141(Not recommend it to No-Pb assembly process)

Normal Tg FR4(Halogen free)

Shengyi S1155

Shengyi S1155


High Tg FR4(Halogen free)

Shengyi S1165

Shengyi S1165


HDI PCB material

LDPP(IT-180A 1037&1086)、Normal PP 106&1080

LDPP(IT-180A 1037&1086)、Normal PP 106&1080


Hight CTI

Shengyi S1600

Shengyi S1600


High Tg FR4

FR408、FR408HR、IS410、FR406、GETEK、PCL-370HR;IT180A、IT-150DA;N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI;Megtron 4、Megtron 6(Panasonic);EM-827(Elite);GA-170(Grace Electron );NP-180(Nanya);TU-752、TU-662(Taiwan Union);MCL-BE-67G(H)、MCL-E-679(W)、MCL-E-679F(J)(Hitachi);VT-47(Ventec)

IT180A、GETEK、PCL-370HR、N4000-13、N4000-13EP、N4000-13SI、N4000-13EP SI


Ceramic Particle Filled Laminates

Rogers4350、Rogers4003、25FR、25N

Rogers4350、Rogers4003、25FR、25N


PTFE Laminates

Rogers series、Taconic series、Arlon series、Nelco series、Taizhou Wangling F4BK series、TP series;

Taconic (TLX、TLF、TLY、RF、TLC、TLG series);Arlon(Diclad、AD series)


PTFE PP

Taconic TP series、TPG series、TPN series、HT1.5(1.5mil)、Fastrise series

/


Hybrid laminating

Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)

Rogers/Taconic/Arlon/Nelco laminate with FR-4 material(including partial Ro4350B hybrid laminating with FR-4)


PCB type

Rigid pcb

Backplane、HDI、High multi-layer blind&buried PCB、Embedded Capacitance、Embedded resistance board 、Heavy copper power PCB、Backdrill、Semiconductor Test products.

Backplane、HDI、High multi-layer blind&buried PCB、Backdrill

Buildings

Blind&buried via type

mechanical blind&burried vias with less than 3 times laminating

mechanical blind&burried vias with less than 2 times laminating

HDI PCB

1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating

1+n+1,1+1+n+1+1,2+n+2,3+n+3(n buried vias≤0.3mm),Laser blind via can be filling plating


Finish treatment

Lead free

Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold finge

Flash gold(electroplated gold)、ENIG、Hard gold、Flash gold、HASL Lead free、OSP、ENEPIG、Soft gold、Immersion silver、Immersion Tin、ENIG+OSP,ENIG+Gold finger,Flash gold(electroplated gold)+Gold finger,Immersion silver+Gold finger,Immersion Tin+Gold fing

Leaded

Leaded HASL

Leaded HASL


aspect ratio

10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)

10:1(HASL Lead free、HASL Lead、ENIG、Immersion Tin、Immersion silver、ENEPIG);8:1(OSP)


Max finished size

HASL Lead 22"*39";HASL Lead free 22"*24";Flash gold 24"*24";Hard gold 24"*28";ENIG 21"*27";Flash gold(electroplated gold) 21"*48";Immersion Tin 16"*21";Immersion silver 16"*18";OSP 24"*40";

HASL Lead 22"*39";HASL Lead free 22"*24";Flash gold 24"*24";Hard gold 24"*28";ENIG 21"*27";Flash gold(electroplated gold) 21"*48";Immersion Tin 16"*21";Immersion silver 16"*18";OSP 24"*40";


MIN finished size

HASL Lead 5"*6";HASL Lead free 10"*10";Flash gold 12"*16";Hard gold 3"*3";Flash gold(electroplated gold) 8"*10";Immersion Tin 2"*4";Immersion silver 2"*4";OSP 2"*2";

HASL Lead 5"*6";HASL Lead free 10"*10";Flash gold 12"*16";Hard gold 3"*3";Flash gold(electroplated gold) 8"*10";Immersion Tin 2"*4";Immersion silver 2"*4";OSP 2"*2";


PCB thickness

HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm;

HASL Lead 0.6-4.0mm;HASL Lead free 0.6-4.0mm;Flash gold 1.0-3.2mm;Hard gold 0.1-5.0mm;ENIG 0.2-7.0mm;Flash gold(electroplated gold) 0.15-5.0mm;Immersion Tin 0.4-5.0mm;Immersion silver 0.4-5.0mm;OSP 0.2-6.0mm;


MAX high to gold finger

1.5inch

1.5inch


Min space between gold fingers

6mil

8mil


Min block space to gold fingers

7.5mil

7.5mil


Plating/coatin g thickness

Tin thickness

2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)

2-40μm (0.4μm on large tin area of Leaded HASL, 1.5μm on large tin area of HASL lead free)

OSP

0.2-0.6μm

0.2-0.6μm


ENIG

Ni: 3-8μm; Au: 0.05-0.1μm

Ni: 3-8μm; Au: 0.05-0.1μm


Immersion Silver

0.2-0.4μm

0.2-0.4μm


Immersion Tin

≥1.0

≥1.0


Hard gold

0.1-4.0μm

0.1-2.0μm


Soft gold

0.1-4.0μm

0.1-4.0μm


ENEPIG

Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm

Ni: 3-8μm, Pd:0.05-0.15μm, Au: 0.05-0.1μm


Flash gold(electroplated gold)

Ni:≥3μm ; Au: 0.025-0.1μm ;base copper≤1 oz

Ni:≥3μm ; Au: 0.025-0.1μm ;base copper≤1 oz


electroplated Gold finger

Ni:≥3μm ; Au: 0.25-1.5μm(The Thinnest point)

Ni:≥3μm ; Au: 0.25-1.5μm(The Thinnest point)


Carbon

10-50μm

10-50μm


Soldermask

0.4-0.7mil (on copper area), 0.2-0.31mil(on via pad),≥0.2mil(on circuits around the corner, just for one-time print and copper thickness<48um)

0.4-0.7mil (on copper area), 0.2-0.31mil(on via pad),≥0.2mil(on circuits around the corner, just for one-time print and copper thickness<48um)


Blue plastic

8--31.5mil

8--16mil



©Copyright 2017 by 4PCBA.com. All Rights Reserved.